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Application Note: Crimp & Stake Verification

Application note coverMinimizing waste and increasing crimp test processes efficiency are major challenges in manufacturing. Improperly crimped sub-components and batch testing practices cause high scrap rates. Additionally, inadequate testing practices increase waste; some parts will fail visual or other tests, but further tests show that the crimp was in fact satisfactory. 

sigPOD offers a range of feature checks for crimp analysis, allowing device manufacturers to increase efficiency, drastically lower scrap rates, and maintain robust historical test data. 

Read the Application Note to learn more.